-
CONEVO Spot Stock Overview: From Interface and Logic to Power and Discrete Devices
In an electronic bill of materials, interface, logic, memory and power chips often come from different manufacturers and product lines of different eras. For engineering and procurement teams, parameters can be confirmed against datasheets; the real difficulty lies elsewhere — whether a device is st...Read more -
Meta and Apple: A Rare Technical Collaboration
On October 15, Meta released Muse Spark Open, an open-weight model, and announced that it has been optimized to run locally on two Mac Studio systems equipped with the M5 Ultra chip. This marks a rare public collaboration between the two companies since 2017.The two have a long history of confrontat...Read more -
Japan to Fund $21 Billion as GF Builds Two New Fabs in New York
On October 14, GlobalFoundries (GF) announced that it had been selected as the technology provider and operator for two new wafer fabs at its Malta, New York campus. The project falls under the U.S.-Japan trade and investment cooperation framework, with Japan providing up to $21 billion in total fun...Read more -
LX Semicon Sells Over 60 SiC Patents As A Bundle
South Korea's LX Semicon has put more than 60 patents covering silicon carbide (SiC) power devices and epitaxial wafers up for sale as a single package, marking the final stage of its withdrawal from the SiC business.Patent Portfolio Sold as One PackageAccording to Korean outlet The Elec, the pa...Read more -
AI and Quantum Consolidation: Amazon and IonQ Make Major Moves
Amazon in Talks to Acquire Decart for Roughly $7 BillionAccording to a Wall Street Journal report on October 11, Amazon is in negotiations to acquire AI startup Decart for approximately $7 billion. If talks proceed smoothly and no competing bidder emerges, the deal could be reached fairly quickly.De...Read more -
CPLD, FPGA, ASIC: Selection Logic and Typical Applications
In digital circuit design, CPLDs, FPGAs and ASICs represent three distinct implementation paths.A CPLD (complex programmable logic device) targets relatively small-scale logic circuits. It uses a fixed internal interconnect architecture, with macrocells typically numbering in the hundreds. CPLDs are...Read more -
USITC Launches AI Power Delivery Patent Investigation (337-TA-1526)
On October 9, 2026, the U.S. International Trade Commission (USITC) voted to launch a Section 337 investigation into "Certain Vertical Power Delivery Systems, Components Thereof, and Computing Systems Containing the Same," designated Investigation No. 337-TA-1526. The case stems from a com...Read more -
Rad-Hard Chips: Microchip Acquires VORAGO
On the 9th, Microchip Technology announced that it has completed the acquisition of VORAGO Technologies. VORAGO is a privately held semiconductor company based in Austin, Texas, focused on the design and manufacture of Rad-Hard and Rad-Tolerant MCUs and MPUs. The specific terms of the transaction we...Read more -
U.S. Advanced Packaging: GF and TSMC Reach $2 Billion Agreement
On October 8, 2026, GlobalFoundries (GF) and TSMC signed a multi-year manufacturing cooperation agreement with a total value of approximately $2 billion and an initial term of five years. Under the deal, GF will expand wafer capacity at its Malta, New York fab to produce silicon interposers for TSMC...Read more -
Toshiba Invests ¥60 Billion to Expand HDD Capacity
Toshiba plans to invest about ¥60 billion to expand its hard disk drive (HDD) production base in the Philippines, aiming to double HDD capacity for AI data centers in fiscal 2027 compared with fiscal 2025. This will be the HDD division's first large-scale investment in about five years. Its Phil...Read more
