On October 8, 2026, GlobalFoundries (GF) and TSMC signed a multi-year manufacturing cooperation agreement with a total value of approximately $2 billion and an initial term of five years. Under the deal, GF will expand wafer capacity at its Malta, New York fab to produce silicon interposers for TSMC's CoWoS® advanced packaging ecosystem. The arrangement would establish the first domestic U.S. supply source for silicon interposers supporting advanced packaging, with volume production expected to begin ramping in the first half of 2028.

Silicon interposers are a core component of the CoWoS-S packaging solution. TSMC's CoWoS-S technology implements high-density interconnect routing on large silicon interposers and integrates embedded deep trench capacitors, allowing logic chips and HBM to be tightly integrated within a single package. These interposers are custom silicon wafers containing TSVs. They provide high-density connections between logic chips and HBM stacks, shortening transmission distances to the millimeter scale and thereby significantly improving I/O density and bandwidth efficiency.

The underlying driver of the collaboration is continued tightness in CoWoS capacity. According to a Counterpoint Research report, TSMC's CoWoS supply-demand gap will remain around 20% in 2026, even as its internal capacity expands toward 185,000 wafers per month. The gap is expected to narrow to about 10% only by 2027. Against this backdrop, GF is using its established U.S. manufacturing capacity to supplement TSMC's silicon interposer capacity. This should help ease the capacity bottleneck in TSMC's advanced packaging operations and allow chip customers to label their final products as "fully manufactured and packaged in the United States."

Hot-Selling ICs and Supply Services

CONEVO is an independent IC distributor focused on global sourcing, shortage solutions, and inventory integration. Its coverage includes FPGAs, MCUs, DSPs, PMICs, power devices, and other categories, helping customers reduce procurement risk and shorten lead times. CONEVO's hot-selling parts include:

● TPS62065QDSGRQ1 — TI 3 MHz, 2 A automotive-grade synchronous step-down converter, AEC-Q100 qualified, 2.9 V to 6 V wide input.

● XC3S400AN-4FGG400I — AMD/Xilinx Spartan-3AN series FPGA, 400K system gates, 8,064 logic cells, 311 I/O, integrated non-volatile flash.

● M27C256B-12F1 — STMicroelectronics 256 Kbit UV-erasable EPROM, 32K x 8 organization, 120 ns fast access.

● PMEG1030EH,115 — Nexperia Schottky barrier rectifier, 10 V reverse voltage, 3 A forward current, ultra-low forward voltage drop of 530 mV @ 3 A.

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