Rad-Hard Chips: Microchip Acquires VORAGO

Rad-Hard Chips: Microchip Acquires VORAGO

On the 9th, Microchip Technology announced that it has completed the acquisition of VORAGO Technologies. VORAGO is a privately held semiconductor company based in Austin, Texas, focused on the design and manufacture of Rad-Hard and Rad-Tolerant MCUs and MPUs. The specific terms of the transaction we...

U.S. Advanced Packaging: GF and TSMC Reach $2 Billion Agreement

U.S. Advanced Packaging: GF and TSMC Reach $2 Billion Agreement

On October 8, 2026, GlobalFoundries (GF) and TSMC signed a multi-year manufacturing cooperation agreement with a total value of approximately $2 billion and an initial term of five years. Under the deal, GF will expand wafer capacity at its Malta, New York fab to produce silicon interposers for TSMC...

Toshiba Invests ¥60 Billion to Expand HDD Capacity

Toshiba Invests ¥60 Billion to Expand HDD Capacity

Toshiba plans to invest about ¥60 billion to expand its hard disk drive (HDD) production base in the Philippines, aiming to double HDD capacity for AI data centers in fiscal 2027 compared with fiscal 2025. This will be the HDD division's first large-scale investment in about five years. Its Phil...

MLCC Guide: Model Reference for Samsung CL, Murata GRM, and Yageo CC Series

MLCC Guide: Model Reference for Samsung CL, Murata GRM, and Yageo CC Series

Multilayer ceramic capacitors (MLCCs) are made by alternately stacking and sintering ceramic dielectrics and metal electrodes. With extremely low equivalent series resistance and equivalent series inductance, a non-polarized design, and high volumetric capacitance density, they have become the most ...

Samsung Electro-Mechanics to Invest US$4.4 Billion in FC-BGA Expansion

Samsung Electro-Mechanics to Invest US$4.4 Billion in FC-BGA Expansion

On September 28, 2026, the board of Samsung Electro-Mechanics approved a capital expenditure plan totaling KRW 4.27 trillion (about US$4.4 billion) to expand its FC-BGA packaging substrate production facility in Sejong, South Korea. The investment period begins September 28, 2026 and runs throu...

Apple and Qualcomm Renew Baseband Patent License Agreement

Apple and Qualcomm Renew Baseband Patent License Agreement

On September 24, Qualcomm announced the renewal of its global patent license agreement with Apple, with the new agreement taking effect on April 1, 2027. This marks another key renewal, following the 2019 settlement and the expiration of the 2023 chip supply agreement. The rates, duration, and finan...

Voltage Supervisor IC Selection: From Key Parameters to Selected Models

Voltage Supervisor IC Selection: From Key Parameters to Selected Models

When MCUs, DSPs, and FPGAs operate below their specified minimum operating voltage, internal logic may enter race conditions, causing data corruption in Flash/EEPROM during write operations and even unpredictable program-counter jumps. More importantly, when the supply voltage deteriorates, internal...

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