Qualcomm Chip Prices, Up Double-Digit Percentage
On July 24, 2026, Qualcomm, the world's leading smartphone chip supplier, formally notified customers that chip prices will increase by double-digit percentages effective September 1. In its notification, Qualcomm stated that it can no longer absorb continuously rising supplier costs, noting tha...
NVIDIA Invests $1.5 Billion in Amkor for Advanced Packaging Capacity Expansion
On July 23, 2026, NVIDIA, the global leader in AI chips, signed a multi‑year strategic agreement worth $1.5 billion with Amkor Technology, a major U.S.‑based outsourced semiconductor assembly and test (OSAT) provider. Under the deal, NVIDIA will provide funding in the form of prepayments to support ...
AMD and Anthropic Reach Multimillion‑Dollar AI Server Procurement Agreement
On July 22, 2026, AMD and Anthropic jointly announced a strategic partnership, with the total value of the transaction reaching hundreds of billions of dollars. Under the agreement, Anthropic will deploy up to 2 gigawatts of AMD Instinct MI450 series GPUs within AMD Helios rack‑scale solutions, with...
ABB Acquires Advantics to Strengthen Silicon Carbide Power Conversion Portfolio
In July 2026, ABB, a leader in electrification and automation technologies, officially announced its acquisition of Advantics, a French specialist in silicon carbide (SiC) power conversion solutions. Financial terms of the transaction were not disclosed, and the deal is expected to close in the four...
TI Popular Components Selection Guide: High-Demand Part Details
The product line of Texas Instruments (TI) covers areas such as analog, power, embedded and interfaces. Its analog chips and embedded processors are widely used in industries like industrial, automotive and consumer electronics. Based on the TI device models that have received high market attention ...
UMC's Dual-Track Advanced Packaging Strategy: Silicon Interposer and TGV Tech
In the fast-evolving landscape of advanced packaging, UMC has charted a distinctive course. Rather than following a single path, the foundry is simultaneously expanding its silicon interposer capacity and positioning itself for next-generation TGV (Through-Glass Via) packaging technology—a dual-pron...
Intel First to Achieve High-NA EUV Mass Production for Logic Chips
On July 15, 2026, ASML officially announced that Intel Foundry has successfully utilized ASML's high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography technology to mass-produce certain processors from the third-generation Core Ultra series, codenamed "Panther Lake," on ...
